Applied Materials has acquired a 9% stake in BE Semiconductor Industries (BESI), marking a significant investment in the semiconductor assembly equipment manufacturer. This strategic move is intended to bolster their collaboration in the field of advanced semiconductor packaging technology, areas both companies have been working closely on since 2020, according to Insider Monkey.
The collaboration between Applied Materials and BESI has focused on developing a comprehensive solution for die-based hybrid bonding. This technology, which enables more efficient semiconductor chips through copper-to-copper connections, aims to enhance performance and reduce power consumption and costs. The move marks an expansion of their efforts in integrating hybrid bonding technology into the mainstream semiconductor manufacturing process.
Despite the stake acquisition, Applied Materials has clarified that it does not plan to seek board representation within BESI or purchase additional shares. The investment was executed through market-based transactions and does not require regulatory approval. The company views this as part of a long-term commitment to advancing semiconductor technology alongside BESI, yet emphasizes no intentions for a full acquisition at this point.
